According to the latest rumors, Apple, Samsung and HTC are reportedly interested in the issue of efficient and powerful smartphone that will incorporate some form of liquid coolant. According to Digitimes, the three companies will produce "ultra-thin heat pipes" in the next few generations of its smart phones.
Cooling systems that can be used in phones are similar to those found in laptop computers, which are used to transfer heat from the CPU and wireless chips. NEC recently announced smartphone, known as Medias X06E, which uses heat pipes with a diameter of only 0.6mm, half the size of the tubes used in portable computers.
Digitimes claims that Apple, Samsung and HTC smartphones will publish with a mechanism for cooling incipience earliest in the fourth quarter of this year.
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